Just built this system last night. Finally upgraded/downsized from an i7-4790K build inside a Define R4 case.
Thanks for all the feedback. I've been testing with 2x NF-S12A (non Chromax) added as exhaust at the top of the case; this dropped GPU temps down by about 5-8C but had no effect on anything else. If you use the Gigabyte X570 I AORUS PRO WIFI board you will not be able to fit fans above the NH-D15 as the Gigabyte has the CPU socket placed higher than the Strix x570-I. Ryzen Master reported CPU temps between 75-80C during 30 minutes of AIDA64 stress test. The 2080 Ti reached 67-68C after about 35 minutes of OCCT. My front and rear NVMEs are usually within 3C of each other during GPU loads; the WD SN750 in the rear has a 2.0mm Thermal Grizzly Minus Pad 8 on top of it to sink heat into the back of the case. I guess you could say the thermal pad is really good or the front heatsink is really bad. Both NVMEs idle around 35C and can get up to 57C/60C when the 2080 Ti is warming up the case.
I am most disappointed by the temps of the x570 chipset itself. About 30 minutes after boot, it has warmed up to about 60C and will approach 80C during gaming. I am still debating whether to take everything apart just to try replacing the thermal pad on the x570 heatsink with either paste or a better thermal pad. On the bright side, I can't hear the chipset fan when the chipset is at the low 60s; fan rpm is about 3000 at those temps. When the chipset approaches 80C, I can make out the faint whine of the chipset fan over my other fans (chassis fans run fixed at just below 900rpm).
I was expecting a delivery of Chromax versions of the NF-S12A along with a GPU support today but neither have arrived yet. Will add newer pics when those things arrive.
Got my Chromax fans today along with the GPU Support and added new pics. I also managed to straighten the SF750 mounting; for whatever reason the foam padding for the PSU mount was thicker on the bottom than the top so the SF750 looked like it angled upwards before.
I have made some attempts at reducing the x570 chipset temperature by replacing the thermal pad used. My first attempt was just with the leftover 2.0mm Thermal Grizzly Minus Pad 8 that I used for my rear NVME. This pad was thicker than stock and ended up being maybe 1-2C warmer. I tried again just now with a 1.0mm FujiPoly 17w/mk thermal pad and this appears to be 3-5C cooler than the stock thermal pad so far. The standoffs for the heatsink are too high so it is not possible to use thermal paste instead of a thermal pad.
Updated the gallery with the build's final form; also added a banna for scale. I returned the NF-S12A that was on the bottom and am just using the NF-A15 that came with the D15. I have spent more time tinkering with this build than simply enjoying it, now its time to just enjoy it.
Happy New Year PCPartPicker! I am amazed it took me about 3 weeks of owning this system before realizing the top exhaust vents has mounting space for 2x 140mm fans. The Fractal Design site only mentions the the top spacing as being 1x 120mm/140mm. So of course I returned the 2x NF-S12A fans last week and replaced them with 2x NF-A14s. I thought I had planned this build pretty well but this is the fan arrangement I should've used from the start.
There aren't many ITX x570 boards to choose from at present. There's this, the Impact, Aorus x570-I and the AsRock. According to Buildzoid, this has the superior VRM solution compared to the Aorus and is fully compatible with the Noctua NH-D15 if you prefer air coolers. I took off one star because of how lame the x570 cooling solution is. If you get this board I recommend swapping the thermal pad from the start to a 1.0mm Fujipoly Ultra Extreme pad. This will shave off a few degrees compared to stock.
EDIT: Taking off another star since there seems to be a few people who got this board without a thermal pad between the x570 chipset and the heatsink. So the quality control on this board seems to be questionable. See https://www.reddit.com/r/Amd/comments/ehfawr/no_thermal_interface_between_chipset_and_heatsink/ and https://www.reddit.com/r/sffpc/comments/eo5p5c/i_figured_out_why_chipset_was_hot/
I was able to enable DOCP using this kit with no issues. If you're wondering why this kit has such a massive premium over the F4-3600C16D-32GTZNC, it's because this kit uses Samsung B-Die.
I feel this case is extremely underrated. It's been on the market since 2016 and of course there are much more premium ITX cases such as the NCASE M1, Dan A4, and Ghost S1. However the Define Nano S is well under $100 (I've even purchased one from Amazon for $39.99) and by pairing it with an SFX PSU, you can easily fit a 2.5+ slot GPU and have a massive air cooler like the NH-D15.